Recently, Samsung announced that it has started mass production of the industry's first uMCP products based on 12GB LPDDR4X and UFS multi-chip packages. Micron has also launched uMCP products, based on the 1znm LPDDR4X and UFS multi-chip package uMCP4, which can provide eight different configurations ranging from 3GB-8GB + 64GB-256GB,The multi-chip packaged uMCP solution launched by Samsung and Micron is expected to replace eMCP as the best solution for 5G mobile phones to spread to the low-end and mid-end markets. It will meet the growing performance and capacity requirements of the mobile market and achieve close to high-end flagship intelligence Phone-like performance.
Where does uMCP come from?
uMCP is based on eMCP. Everyone is familiar with eMCP. It is eMMC (NAND Flash + control chip) and low-power DRAM package. It is currently widely used in low-end and middle-end mobile phones. Development trends to meet the future development of 5G mobile phones.
Why is eMCP still dominant in the low-end market?
In the early smart phones, the mainstream storage solution was NAND MCP. SLC NAND Flash and low-power DRAM were packaged together, which had the advantages of low production costs and other advantages. With the higher requirements for storage capacity and performance of smart phones, especially with the widespread popularity of the Android operating system, and the large number of programs and software pre-installed by mobile phone manufacturers, the demand for large capacity is increasing.Compared with the traditional MCP, eMCP can not only increase the storage capacity and meet the requirements of large capacity for mobile phones, but also the embedded control chip can reduce the burden of the main CPU calculation, thereby simplifying and better managing large-capacity NAND Flash chips And save space on the phone's motherboard.eMCP is favored by low-end customers, and is still widely used in low-end and mid-range mobile phones.The main reason is that eMCP has the advantage of high integration, including two chips, eMMC and low-power DRAM, which can simplify the mobile phone PCB for terminal manufacturers The circuit design of the board shortens the delivery cycle.Second, eMCP is a package of eMMC and low-power DRAM, which is lower than the separate purchase price of eMMC and mobile DRAM, which is conducive to reducing costs for low-to-mid-end mobile phones, especially in the first two years. The period of DRAM price increase is more favorable for trading and bargaining. However, eMCP only has stable sources of supply for Samsung, SK Hynix, and Micron.
uMCP is in line with the development trend of UFS and meets the needs of 5G mobile phones.
High-end smart phones are based on high performance requirements, and the CPU processor needs to communicate with DRAM at high frequencies. Therefore, high-end flagship mobile phone customers prefer to use CPU and LPDDR for POP packaging, and discrete eMMC or UFS storage solutions. It can reduce the difficulty for engineers to design PCBs, reduce the interference of CPU and DRAM communication signals, and improve the performance of end products. As production difficulty increases, production costs also increase.The development of 5G mobile phones will continue to penetrate from high-end machines to low-end machines to achieve universal popularity. It also puts forward higher requirements for large-capacity and high-performance.The full name of eMMC is “embedded Multi Media Card”, which was established by the MMC Association. UFS stands for "Universal Flash Storage" and was established by the Solid State Technology Association JEDEC. Compared with eMMC, UFS has the advantage of using a high-speed serial interface instead of the traditional parallel interface and using the full-duplex mode. The faster UFS is the successor of eMMC.Currently UFS 3.0 is the latest specification, with a single-channel bandwidth of up to 11.6Gbps and a dual-channel two-way bandwidth of up to 23.2Gbps. Samsung and Armor have mass-produced UFS 3.0 products, including Samsung Note10, Meizu 16T, iQOO Neo 855, etc Consecutively equipped with UFS 3.0 to improve the application experience of mobile phones.uMCP combined with LPDDR and UFS not only has high performance and large capacity, but also takes up 40% less space than PoP + discrete eMMC or UFS solutions, reduces memory chip occupation and enables a more flexible system design, High-density, low-power storage solutions for smartphone designs.