TO252-5L flip-chip Burn in socket with multiple pins for high voltage low current testing.

TO252-5 is a type of package, also known as DPAK-5 package.

It is a package with 5 pins, commonly used for integrated circuits or semiconductor devices.

The TO252-5 package is an extension of the TO252 package, with two additional pins added to provide more functionality and connection options.

This package is typically used for power devices and driver devices, such as power MOSFETs, power ICs, and driver ICs.

The pin spacing and dimensions of the TO252-5 package make it easy to solder onto a circuit board, and it has good heat dissipation performance, making it suitable for applications that require high power handling capabilities.

A flip-chip probe aging socket is a device used for aging testing, typically used for long-term stability testing of electronic components.

This type of socket typically has temperature control and electrical connection capabilities, allowing it to simulate the working conditions of components under different temperature and voltage conditions to evaluate their performance and reliability.

By conducting aging tests in a flip-chip probe aging socket, the lifespan and performance of components under actual operating conditions can be assessed.