IPU Chips and related Package Burn in Socket

IPU (Image Processing Unit) chips are specialized for image processing and are used in various fields, including:

1. Computer Vision: For image recognition, object tracking, and deep learning tasks, supporting applications such as autonomous driving and intelligent monitoring.
2. Photography Devices: In digital cameras and smartphones, IPU chips handle image optimization, noise reduction, color correction, etc., improving photo and video quality.
3. Augmented Reality and Virtual Reality: Supporting efficient image rendering and processing for a more realistic user experience.

Key features of IPU chips:

• High Parallel Processing Capability: Capable of handling multiple image streams and complex computations simultaneously.
• Low Power Design: Optimized for power consumption, suitable for mobile devices and embedded systems.
• Real-Time Processing: Provides low-latency image processing to meet real-time application needs.

Chip Packaging Types

Chip packaging is a critical process that connects the chip to external circuits, with different types suited to various applications:

1. DIP (Dual In-line Package):

• Features: Has two rows of pins, suitable for low-pin-count applications.
• Applications: Typically used in older devices and development boards.

1. QFP (Quad Flat Package):

• Features: Has pins on all four sides, flat package, suitable for higher pin-count applications.
• Applications: Widely used in microcontrollers and integrated circuits.

1. BGA (Ball Grid Array):

• Features: Pins are distributed in ball-shaped solder points on the bottom of the package, providing better electrical performance and thermal management.
• Applications: Used in applications requiring high pin density and good thermal performance, such as computer processors and high-speed interface chips.

1. CSP (Chip Scale Package):

• Features: Package size is close to the chip itself, providing a miniaturization solution.
• Applications: Suitable for portable devices and space-constrained applications.

1. FOPLP (Fan-Out Panel-Level Package):

• Features: Extends pins beyond the package layer, supporting higher pin density and larger chip sizes.
• Applications: High-performance computing and high-frequency applications, such as advanced mobile devices and servers.

Chip Aging Requirements

Chip aging testing aims to evaluate the stability and reliability of chips over long-term use. Main requirements include:

1. High-Temperature Operation:

• Purpose: Simulate high-temperature environments during long-term use to test chip thermal stability.
• Method: Run the chip under temperatures higher than normal operating conditions, typically around 85°C or higher.

1. Electrical Stress:

• Purpose: Verify chip performance and durability under different voltage and current conditions.
• Method: Apply normal operating voltage multiples and over-voltage tests.

1. Humidity Testing:

• Purpose: Check chip performance in high-humidity environments to prevent moisture-induced failures.
• Method: Expose the chip to high humidity environments, typically 85% RH (relative humidity) and 85°C.

1. Mechanical Stress:

• Purpose: Test chip resistance to physical shocks and vibrations.
• Method: Simulate mechanical stress encountered during transportation and use, such as vibration and impact testing.

ANDK Aging Socket Response Methods

The ANDK aging socket is designed to meet chip aging test requirements, featuring:

1. High-Temperature and High-Voltage Testing:

• High-Temperature Control: ANDK aging sockets have built-in temperature control systems to precisely manage test temperatures, simulating various high-temperature conditions.
• Electrical Stress Application: Supports high-voltage application, simulating chip operation under extreme electrical conditions.

1. Efficient Heat Dissipation Design:

• Heat Dissipation System: Equipped with advanced heat dissipation designs using high thermal conductivity materials and heat sinks to ensure the chip does not overheat during testing.
• Airflow Optimization: Well-designed airflow systems help evenly dissipate heat, keeping the chip within an ideal operating temperature range.

1. Modular Design:

• Supports Different Packages: The modular design allows for quick replacement of different adapter modules, supporting various packaging types, including high-density packages like FOPLP.
• Easy Maintenance: Modular design makes maintenance and adjustments simpler, improving the efficiency of the testing equipment.

1. Precise Testing Control:

• Automated Testing: ANDK aging sockets support automated testing processes, reducing human error and ensuring the accuracy of test data.
• Data Recording and Analysis: Provides real-time data recording and analysis capabilities, helping engineers accurately assess chip aging and performance changes.

With these features, the ANDK aging socket effectively addresses the aging test requirements for high-density packages like FOPLP, ensuring chip long-term reliability and stability.