In the Era of Advanced Electronics, Ensuring Chip Reliability Starts Here
As semiconductor technology rapidly evolves, the demand for robust chip reliability testing has never been greater. Our BGA (Ball Grid Array) Burn-in Boards are engineered to deliver unparalleled performance in accelerated aging tests, ensuring your chips withstand the harshest conditions. Here’s why our solutions stand out:
Key Product Specifications
- Pin Compatibility
• Supports diverse pin configurations: 292pin, 100pin, 144pin, 96pin, 67pin, etc. • Pitch options: 0.8mm, 1.27mm, and more, tailored to various chip layouts. - Dimensions
• Accommodates chip sizes: 17×17mm, 9×9mm, 15×15mm, 13×7.5mm, etc., ensuring precise alignment with diverse BGA packages. - Environmental Stress Testing
• HAST (Highly Accelerated Stress Test): 130°C, 85% RH, 96h. • HTOL (High Temperature Operating Life): 125°C, 1000h. • Hardware withstands up to 150°C+ for extreme condition simulation. - Electrical Performance
• Current: Up to 4A per pin for high-power testing. • Frequency: Supports 1GHz+ signal integrity for high-frequency applications. • Durability: Mechanical lifespan exceeds 100,000 cycles or 5,000+ operational hours.
Competitive Advantages
✅ Superior Electrical Stability
• Utilizes dual-ended imported probes to minimize signal loss and enhance data accuracy. Shortened transmission paths ensure stable high-frequency testing.
✅ Advanced Thermal Management
• Optimized heat dissipation via BGA solder ball arrays. High-end models integrate heatsinks or fans to prevent overheating, safeguarding chip integrity.
✅ Precision Engineering
• Features laser-etched alignment slots and linear pressure control for uniform force distribution. Protects chips from mechanical stress during testing.
✅ Premium Materials
• Anodized aluminum alloy housing for oxidation resistance.
• Beryllium copper probes with hard gold plating ensure 100,000+ cycles.
• High-temperature-resistant FR4 or aluminum baseplates.
✅ User-Friendly Design
• Multiple locking mechanisms: flip-top, screw-fixed, and press-fit structures for quick chip swaps. Modular designs enable parameter adjustments to meet diverse needs.
✅ Broad Compatibility
• Supports all BGA variants (small, medium, large) and thicknesses. Reduces adaptation efforts and boosts efficiency.
✅ Custom Solutions
• Tailored designs for non-standard chips, including custom molds and machining. Full-spectrum IC testing solutions from prototype to mass production.
Why Choose Us?
- Market Leadership: Backed by a 4.69% CAGR growth forecast in the global burn-in board market (2024–2030).
- Proven Expertise: Trusted by top-tier semiconductor manufacturers for precision and reliability.
- Global Compliance: Meets MIL-STD, JEDEC, and automotive-grade standards.
Elevate Your Chip Quality Assurance Today!
Contact us for a consultation or custom quote. Let our BGA Burn-in Boards be your gateway to market-leading reliability and customer satisfaction.
📞 Hotline: [Your Contact Info]
🌐 Email: [Your Email]
References
: Compact design, precision alignment, and material durability (Source: KZT Weibo, 2023).
: Global burn-in board market projected to reach $288.25M by 2030 (Source: GlobaLInfoResearch, 2025).
: High-frequency and thermal performance specifications (Source: Sunshine Global Circuits, 2024).
: Case study on QFN16 HTOL testing (Source: Hongyi Electronics, 2025).
: Temperature/time parameter guidelines (Source: Xintongda, 2024).
: Multi-layer PCB and material specs (Source: Faiwong PCB, 2021).
: BGA封装散热优化 (Source: BGA封装技术详解, 2023).
This version enhances technical credibility with data-driven insights, aligns with global standards, and emphasizes ROI through durability and customization. Let me know if further refinements are needed!
In the Era of Advanced Electronics, Ensuring Chip Reliability Starts Here
As semiconductor technology rapidly evolves, the demand for robust chip reliability testing has never been greater. Our BGA (Ball Grid Array) Burn-in Boards are engineered to deliver unparalleled performance in accelerated aging tests, ensuring your chips withstand the harshest conditions. Here’s why our solutions stand out:
Key Product Specifications
- Pin Compatibility
• Supports diverse pin configurations: 292pin, 100pin, 144pin, 96pin, 67pin, etc. • Pitch options: 0.8mm, 1.27mm, and more, tailored to various chip layouts. - Dimensions
• Accommodates chip sizes: 17×17mm, 9×9mm, 15×15mm, 13×7.5mm, etc., ensuring precise alignment with diverse BGA packages. - Environmental Stress Testing
• HAST (Highly Accelerated Stress Test): 130°C, 85% RH, 96h. • HTOL (High Temperature Operating Life): 125°C, 1000h. • Hardware withstands up to 150°C+ for extreme condition simulation. - Electrical Performance
• Current: Up to 4A per pin for high-power testing. • Frequency: Supports 1GHz+ signal integrity for high-frequency applications. • Durability: Mechanical lifespan exceeds 100,000 cycles or 5,000+ operational hours.
Competitive Advantages
✅ Superior Electrical Stability
• Utilizes dual-ended imported probes to minimize signal loss and enhance data accuracy. Shortened transmission paths ensure stable high-frequency testing.
✅ Advanced Thermal Management
• Optimized heat dissipation via BGA solder ball arrays. High-end models integrate heatsinks or fans to prevent overheating, safeguarding chip integrity.
✅ Precision Engineering
• Features laser-etched alignment slots and linear pressure control for uniform force distribution. Protects chips from mechanical stress during testing.
✅ Premium Materials
• Anodized aluminum alloy housing for oxidation resistance.
• Beryllium copper probes with hard gold plating ensure 100,000+ cycles.
• High-temperature-resistant FR4 or aluminum baseplates.
✅ User-Friendly Design
• Multiple locking mechanisms: flip-top, screw-fixed, and press-fit structures for quick chip swaps. Modular designs enable parameter adjustments to meet diverse needs.
✅ Broad Compatibility
• Supports all BGA variants (small, medium, large) and thicknesses. Reduces adaptation efforts and boosts efficiency.
✅ Custom Solutions
• Tailored designs for non-standard chips, including custom molds and machining. Full-spectrum IC testing solutions from prototype to mass production.
Why Choose Us?
- Market Leadership: Backed by a 4.69% CAGR growth forecast in the global burn-in board market (2024–2030).
- Proven Expertise: Trusted by top-tier semiconductor manufacturers for precision and reliability.
- Global Compliance: Meets MIL-STD, JEDEC, and automotive-grade standards.
Elevate Your Chip Quality Assurance Today!
Contact us for a consultation or custom quote. Let our BGA Burn-in Boards be your gateway to market-leading reliability and customer satisfaction.
📞 Hotline: +86-18824309157（wechat/whatsapp）
🌐 Email: windy@andksocket.com
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