Coolable Chip Test Socket: Innovative Technology for Low – Temperature Chip Testing

In today’s chip testing field, the demand for testing chip performance under different temperature environments is increasing. Especially for some temperature – sensitive chips, such as QFP100 packaged chips, low – temperature testing is particularly important. Today, we will introduce a unique coolable chip test socket that not only meets the needs of low – temperature chip testing but also has many innovative designs.

1. Socket – Compatible Chips and Core Cooling Components

This coolable test socket is mainly designed for QFP100 packaged chips. A thermoelectric cooling chip is installed to effectively cool chips based on the Peltier effect.

2. High – Efficiency Cooling Structure Design

The cooling chip cools the chip’s bottom through a brass block. The brass, with good thermal conductivity, quickly transfers cold, enabling the chip to reach the preset low – temperature environment. A temperature sensor inside the brass monitors the chip’s temperature.

3. Heat Dissipation Structure Ensures Testing Stability

While the cooling chip cools on the front side, it generates heat on the back. The test socket has a heat dissipation groove filled with coolant and an external structure. This design ensures effective heat dissipation and stable operation of the cooling chip.

4. Working Environment Requirements

This test socket requires a vacuum or dry, moisture – free environment, typically in a vacuum box. In a humid environment, frost on the cooling chip and brass block can affect the cooling effect and test accuracy.

5. Flexibility and Customization

This ANDK customized IC socket is highly flexible. It can be adjusted according to different customer – tested chips, offering personalized testing solutions like other IC sockets for various chip types.

6. Market Demand and Application Scenarios

With the development of chip technology, the demand for low – temperature chip testing is rising. This IC socket meets market needs in aerospace and automotive electronics, serving as a reliable tool for testing chips in extreme temperature environments.