Common Types of Test Sockets for Consumer, Industrial, and Automotive Grade Chips

Test sockets are devices used to facilitate easy insertion and connection of chips during testing. Common types of test sockets include:

1. DIP (Dual In-line Package) Test Socket: Suitable for dual in-line packages.
2. SOP (Small Outline Package) Test Socket: Suitable for small outline packages.
3. QFP (Quad Flat Package) Test Socket: Suitable for quad flat packages.
4. BGA (Ball Grid Array) Test Socket: Suitable for ball grid array packages.
5. LGA (Land Grid Array) Test Socket: Suitable for land grid array packages.
6. QFN (Quad Flat No-lead) Test Socket: Suitable for quad flat no-lead packages.
7. TSOP (Thin Small Outline Package) Test Socket: Suitable for thin small outline packages.
8. PLCC (Plastic Leaded Chip Carrier) Test Socket: Suitable for plastic leaded chip carrier packages.

Burn-in Testing of Automotive Grade Chips

Automotive-grade chips require a series of rigorous burn-in tests to ensure their reliability and stability during vehicle operation. Here are some common burn-in tests:

1. Temperature Cycling Test

• Purpose: To assess chip performance under repeated high and low-temperature changes.
• Method: Alternating the chip between high and low temperatures, usually between -40°C to +125°C or even higher.

1. Humidity Testing

• Purpose: To evaluate chip tolerance in high-humidity environments.
• Method: Conducting long-term burn-in tests at 85°C and 85% relative humidity, typically for 1000 hours.

1. Thermal Shock Testing

• Purpose: To assess chip performance under rapid temperature changes.
• Method: Quickly switching the chip between extreme high and low-temperature environments to test its reliability under thermal shock.

1. High Temperature Operating Life (HTOL) Test

• Purpose: To evaluate the long-term performance of the chip while operating in high-temperature environments.
• Method: Running the chip continuously under high temperatures (e.g., 125°C), typically for 1000 hours or longer.

1. Highly Accelerated Stress Test (HAST)

• Purpose: To simulate accelerated aging of the chip in high-temperature, high-humidity, and high-pressure environments.
• Method: Testing under high temperature (e.g., 130°C to 145°C), high humidity (e.g., 85% to 100% RH), and high pressure (e.g., above 2 atmospheres).

1. Voltage Stress Testing

• Purpose: To evaluate chip performance under over-voltage and under-voltage conditions.
• Method: Long-term testing of the chip under various voltage conditions to assess its stability under voltage fluctuations.

1. Salt Spray Test

• Purpose: To assess the corrosion resistance of the chip in a saline environment.
• Method: Exposing the chip to a salt spray environment, typically to evaluate the corrosion resistance of metal leads and packaging materials.

These burn-in tests are designed to ensure that automotive-grade chips can operate reliably over the long term, especially under extreme and harsh environmental conditions.